ECS to Unveil LIVA Z3 Plus & LIVA Z3E Plus UCFF PCs at CES: Intel’s 10th Gen Core Inside
ECS this week disclosed plans to introduce new LIVA ultra-compact form-factor (UCFF) PCs based on Intel’s 10th Gen Core processors. Set to be fully unveiled at CES next month...
6 by Anton Shilov on 12/18/2019NVIDIA Details DRIVE AGX Orin: A Herculean Arm Automotive SoC For 2022
While NVIDIA’s SoC efforts haven’t gone entirely to plan since the company first started on them over a decade ago, NVIDIA has been able to find a niche that...
33 by Ryan Smith on 12/18/2019ADATA Reveals XPG Hunter SO-DIMMs: Up to DDR4-3000, Up to 32 GB
ADATA has introduced its new family of SO-DIMMs for laptops and small form-factor desktops. The XPG Hunter DDR4 SO-DIMMs offer data transfer rates of up to 3000 MT/s and...
6 by Anton Shilov on 12/17/2019Samsung to Expand 3D NAND Fab in China
Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...
5 by Anton Shilov on 12/17/2019Corsair to Acquire SCUF Gaming
Corsair this week has announced that it will take over SCUF Gaming, a manufacturer of advanced gaming controllers for PCs and consoles. By acquiring SCUF, Corsair not only expands...
15 by Anton Shilov on 12/17/2019OWC Launches ThunderBay 4 Mini DAS: 4 SATA Bays With SoftRAID, Up to 1.5 GB/s
OWC has introduced a new small form factor high performance, high redundancy DAS for the professional market. The ThunderBay 4 Mini incorporates 4 2.5-inch storage bays, allowing it to...
29 by Anton Shilov on 12/16/2019Samsung Unveils Galaxy A51 & Galaxy A71 Mid-Range Smartphones: 6.5/6.7-Inches With 4-Module Cameras
While Samsung draws most of its smartphone reputation from its high-end phones, the bulk of the phones that the company sells are are not the $700+ Galaxy S series...
22 by Anton Shilov on 12/16/2019LG Updates Ultralight Gram Laptops & Convertible: Ice Lake Inside
Along with their flagship 17-inch model, LG this week has also given its 14 and 15.6-inch LG gram laptops an Ice Lake upgrade. The updated machines pair Intel’s Ice...
19 by Anton Shilov on 12/13/2019Western Digital Rolls-Out Two New SweRV RISC-V Cores For Microcontrollers
Western Digital has added two new processor cores — the SweRV Core EH2 and the SweRV Core EL2 — into its SweRV portfolio of microcontroller CPUs. And, keeping in...
14 by Anton Shilov on 12/13/2019Microsoft Announces Xbox Series X: Available Holiday 2020
Microsoft this evening has finally given their long-awaited next generation gaming console a name, announcing the Xbox Series X. The device, formerly known as Project Scarlett, is said to...
83 by Ryan Smith on 12/12/2019Update: Sales of Samsung Galaxy Fold Are Nowhere Near 1 Million Units
Update 12/14: While claims were earlier made by Samsung's Chief Strategy Officer that the company had sold 1 million Galaxy Folds, the company has since stepped in to correct...
20 by Anton Shilov on 12/12/2019Western Digital: Expect More Energy-Assisted Tech For 24 TB & Beyond
Western Digital has been promoting its microwave assisted magnetic recording (MAMR) technology for over a couple of years now, yet surprisingly, its upcoming 18 TB and 20 TB drives...
12 by Anton Shilov on 12/12/2019Samsung to Use SiFive RISC-V Cores for SoCs, Automotive, 5G Applications
At the annual RISC-V Summit this week, Samsung disclosed the use SiFive’s RISC-V cores for upcoming chips for a variety of applications. The company is joining a growing list...
18 by Anton Shilov on 12/12/2019Logitech Releases 4K Pro Magnetic Webcam for Apple Pro Display XDR
This week Apple launched its all-new Pro Display XDR monitor that happens to be one of the most advanced LCDs around, but one thing it lacks is a built-in...
15 by Anton Shilov on 12/12/2019LG’s Lightweight Gram 17-Inch Laptop Gets Intel’s Ice Lake CPU
Thin-and-light notebooks with a 17-inch display are rather rare, as most 17-inch laptops are intended to be high performance desktop replacement-class machines. LG’s gram 17 has been a stand-out...
32 by Anton Shilov on 12/12/2019Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton
Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...
21 by Anton Shilov on 12/11/2019EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look
One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...
29 by Dr. Ian Cutress on 12/11/2019Macronix to Start Shipments of 3D NAND in 2020
Macronix, a Taiwan-based manufacturer for special-purpose memory solutions, will start volume shipments of its own 3D NAND memory in the second half of next year. The company will become...
3 by Anton Shilov on 12/11/2019Microsoft Ends Support for Windows 10 Mobile
Microsoft this week has finally retired Windows 10 mobile, ending support for its smartphone OS. However, in a quirk of differing lifecycle policies, the software giant will continue to...
20 by Anton Shilov on 12/11/2019Intel: Lakefield in 2020, Possible 5G on Foveros
At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...
37 by Dr. Ian Cutress on 12/11/2019